Friday, January 05, 2007

Carbon fiber reinforced compounds are more rigid

A full line of carbon fiber reinforced compounds that are based on chopped carbon fiber, milled carbon fiber and carbon nanotubes provide more rigidity as well as electrical conductivity.

Premix Thermoplastics, announces the addition of a full line of carbon fiber reinforced compounds to the company's PRE-ELEC product portfolio. Based on chopped carbon fiber, milled carbon fiber and carbon nanotubes, the new compounds provide the increased rigidity of carbon fiber as well as the electrical conductivity. Premix carbon fiber compounds are available with as much as 60% carbon fiber in nylon 6 and 66 and PPS, and at least 40% in others, including PP, ABS, PC, POM and PSUL.

The addition of carbon fibers not only increases the flexural modulus (rigidity) of the compound, but also increases the tensile strength, lowers the shrinkage and increases the electrical conductivity.

Compounds that are based on milled carbon fiber are less prone to warpage while compounds that are based on carbon nanotubes can be electrically conductive with as little as 3% fiber reinforcement.

In addition, carbon nanotubes can also create thermally conductive polymer compounds when used at higher loadings.

Standard color is black.

Compounds that are 10% carbon fiber-based are available in a variety of colors that facilitate the color coding of molded parts.

Pre-Elec compounds include most of the commercially available thermoplastics combined with virtually all of the electrically conductive additives including: carbon black, carbon fiber, nickel coated carbon fiber, stainless steel fiber, graphite flake, nickel coated graphite flake, silver and silver coated additives, metal powders and flakes, inherently dissipative polymers (IDPs) and inherently conductive polymers (ICPs).

Premix Thermoplastics is a subsidiary of Premix Oy, a leading manufacturer of electrically conductive compounds in Europe.

It offers customers innovative, reliable and safe plastics raw material solutions in applications ranging from ESD proof packaging to EMI shielding.